CERAMIC HEAT SINK WITH MICRO-POROUS STRUCTURE FOR EFFICIENT THERMAL MANAGEMENT
PART NO SPEC APPLICATION
MPS101020BTF flat type 10*10*2.0mm power IC High temp component transitor
MPS151020BTF flat type 15*10*2.0mm power IC High temp component transitor
MPS151525BTF flat type 15*15*2.5mm power IC High temp component transitor
MPS201525BTF flat type 20*15*2.5mm power IC High temp component transitor
MPS202025BTF flat type 20*20*2.5mm STB,AP Router,G PON,Cable Modem,Broadband,LED TV
MPS252525BTF flat type 25*25*2.5mm STB,AP Router,G PON,Cable Modem,Broadband,LED TV
MPS303025BTF flat type 30*30*2.5mm STB,AP Router,Cable Modem,Broadband,LED TV(SCALAR IC)
MPS404025BTF flat type 40*40*2.5mm STB,AP Router,Cable Modem,Broadband,LED TV(SCALAR IC)
MPW303050BTF wave type 30*30*5.0mm STB,AP Router,Cable Modem,Broadband,LED TV(SCALAR IC)
MPW404050BTF wave type 40*40*5.0mm STB,AP Router,Cable Modem,Broadband,LED TV(SCALAR IC)
custom-made Length:10<L<50(mm) ,width: 10<W<50(mm), thickness: 2.5<T<6(mm) remark: L:W>1:2