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PCB設計中專業(yè)英譯術語之基材： 1. 基材：base material 2. 層壓板：laminate 3. 覆金屬箔基材：metal-clad bade material 4. 覆銅箔層壓板：copper-clad laminate (CCL) 5. 單面覆銅箔層壓板：single-sided copper-clad laminate 6. 雙面覆銅箔層壓板：double-sided copper-clad laminate 7. 復合層壓板：composite laminate 8. 薄層壓板：thin laminate 9. 金屬芯覆銅箔層壓板：metal core copper-clad laminate 10. 金屬基覆銅層壓板：metal base copper-clad laminate 11. 撓性覆銅箔絕緣薄膜：flexible copper-clad dielectric film 12. 基體材料：basis material 13. 預浸材料：prepreg 14. 粘結片：bonding sheet 15. 預浸粘結片：preimpregnated bonding sheer 16. 環(huán)氧玻璃基板：epoxy glass substrate 17. 加成法用層壓板：laminate for additive process 18. 預制內層覆箔板：mass lamination panel 19. 內層芯板：core material 20. 催化板材：catalyzed board ,coated catalyzed laminate 21. 涂膠催化層壓板：adhesive-coated catalyzed laminate 22. 涂膠無催層壓板：adhesive-coated uncatalyzed laminate 23. 粘結層：bonding layer 24. 粘結膜：film adhesive 25. 涂膠粘劑絕緣薄膜：adhesive coated dielectric film 26. 無支撐膠粘劑膜：unsupported adhesive film 27. 覆蓋層：cover layer (cover lay) 28. 增強板材：stiffener material 29. 銅箔面：copper-clad surface 30. 去銅箔面：foil removal surface 31. 層壓板面：unclad laminate surface 32. 基膜面：base film surface 33. 膠粘劑面：adhesive faec 34. 原始光潔面：plate finish 35. 粗面：matt finish 36. 縱向：length wise direction 37. 模向：cross wise direction 38. 剪切板：cut to size panel 39. 酚醛紙質覆銅箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL) 40. 環(huán)氧紙質覆銅箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL) 41. 環(huán)氧玻璃布基覆銅箔板：epoxide woven glass fabric copper-clad laminates 42. 環(huán)氧玻璃布紙復合覆銅箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates 43. 環(huán)氧玻璃布玻璃纖維復合覆銅箔板：epoxide non woven/woven glass reinforced copper-clad laminates 44. 聚酯玻璃布覆銅箔板：ployester woven glass fabric copper-clad laminates 45. 聚酰亞胺玻璃布覆銅箔板：polyimide woven glass fabric copper-clad laminates 46. 雙馬來酰亞胺三嗪環(huán)氧玻璃布覆銅箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates 47. 環(huán)氧合成纖維布覆銅箔板：epoxide synthetic fiber fabric copper-clad laminates 48. 聚四乙烯玻璃纖維覆銅箔板：teflon/fiber glass copper-clad laminates 49. 超薄型層壓板：ultra thin laminate 50. 陶瓷基覆銅箔板：ceramics base copper-clad laminates 51. 紫外線阻擋型覆銅箔板：UV blocking copper-clad laminates 以上即是PCB設計中專業(yè)英譯術語之基材，下期預告：PCB設計中專業(yè)英譯術語之基材的材料，更多更多行業(yè)信息可查閱快點學院訂閱號：eqpcb_cp。 |
